ZHCSLY3B August 2020 – December 2021 SN74HCS164
PRODUCTION DATA
| THERMAL METRIC(1) | SN74HCS164 | UNIT | ||||
|---|---|---|---|---|---|---|
| DYY (SOT) | PW (TSSOP) | D (SOIC) | BQA (WQFN) | |||
| 16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 219.6 | 141.2 | 122.2 | 109.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 128.2 | 78.8 | 80.9 | 111.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 130.9 | 85.8 | 80.6 | 77.9 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 21.7 | 27.7 | 40.4 | 20.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 130.0 | 85.5 | 80.3 | 77.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | 56.6 | °C/W |