ZHCSQH0F December 1982 – April 2022 SN54HC273 , SN74HC273
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings – SN74HC273
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics
- 6.6 Electrical Characteristics – SN54HC273
- 6.7 Electrical Characteristics – SN74HC273
- 6.8 Timing Requirements
- 6.9 Timing Requirements – SN54HC273
- 6.10 Timing Requirements – SN74HC273
- 6.11 Switching Characteristics
- 6.12 Switching Characteristics – SN54HC273
- 6.13 Switching Characteristics – SN74HC273
- 6.14 Operating Characteristics
- 6.15 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DB|20
- NS|20
- N|20
- DW|20
- PW|20
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
12.6 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |