4 Revision History
Changes from Revision D (February 2016) to Revision E (October 2021)
- Changed pinout images style and formatting, removed overlapping
letters in YZP package drawing, corrected BGA pin numbers in the Pin
Functions table, changed VCC and GND pin TYPE From: "—" To:
"P" in the Pin Functions table and added footnote to the Pin
Functions table to define pin typesGo
- Changed maximum output voltage in the low state in the
Section 6.1
table to 4.6 VGo
- Changed the VO Output voltage in the
Section 6.3
table from 'VCC' to '3.6'Go
- Updated RθJA values to more accurately reflect device
characteristics: YFP 132 to 125.4, DCK 252 to 302.4, DRY 234 to 338, DSF 300 to
372.5, added standard thermal characteristics for all packages
(RθJC(top), RθJB, ΨJT, ΨJB,
RθJC(bot))Go
Changes from Revision C (November 2014) to Revision D (February 2016)
- Changed the VCC pin TYPE From: "I" To: "—" in the Pin
Functions tableGo
- Added "Junction temperature" to the
Section 6.1
table Go
- Deleted the IOH High-level output current from the
Section 6.3
table Go
- Deleted VOH PARAMETER from the
Section 6.5
table, these specifications do not pertain to open drain devicesGo
Changes from Revision B (September 2009) to Revision C (November 2014)
- 刪除了訂購(gòu)信息 表Go
- 添加了應(yīng)用、器件信息 表、引腳功能 表、處理等級(jí) 表、熱性能信息 表、典型特性、特性說(shuō)明 部分、器件功能模式、應(yīng)用和實(shí)施 部分、電源相關(guān)建議 部分、布局 部分、器件和文檔支持 部分以及機(jī)械、封裝和可訂購(gòu)信息 部分Go
- 更新了特性 中的 Ioff
Go