ZHCSFW6A December   2016  – February 2020 SN65MLVD206B

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
   1.     Device Images
      1.      簡(jiǎn)化原理圖、 SN65MLVD206B
4. 4 修訂歷史記錄
5. 5 Pin Configuration and Functions
   1.     Pin Functions
6. 6 Specifications
   1. Table 1.  Absolute Maximum Ratings
   2. Table 2.  ESD Ratings
   3. Table 3.  Recommended Operating Conditions
   4. Table 4.  Thermal Information
   5. Table 5.  Electrical Characteristics
   6. Table 6.  Electrical Characteristics – Driver
   7. Table 7.  Electrical Characteristics – Receiver
   8. Table 8.  Electrical Characteristics – BUS Input and Output
   9. Table 9.  Switching Characteristics – Driver
   10. Table 10. Switching Characteristics – Receiver
   11. 6.1       Typical Characteristics
7. 7 Parameter Measurement Information
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagrams
   3. 8.3 Feature Description
      1. 8.3.1 Power-On-Reset
      2. 8.3.2 ESD Protection
   4. 8.4 Device Functional Modes
      1. 8.4.1 Operation with VCC < 1.5 V
      2. 8.4.2 Operations with 1.5 V ≤ VCC < 3 V
      3. 8.4.3 Operation with 3 V ≤ VCC < 3.6 V
      4. 8.4.4 Device Function Tables
      5. 8.4.5 Equivalent Input and Output Schematic Diagrams
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Application
      1. 9.2.1 Multipoint Communications
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
         1. 9.2.3.1  Supply Voltage
         2. 9.2.3.2  Supply Bypass Capacitance
         3. 9.2.3.3  Driver Input Voltage
         4. 9.2.3.4  Driver Output Voltage
         5. 9.2.3.5  Termination Resistors
         6. 9.2.3.6  Receiver Input Signal
         7. 9.2.3.7  Receiver Input Threshold (Failsafe)
         8. 9.2.3.8  Receiver Output Signal
         9. 9.2.3.9  Interconnecting Media
         10. 9.2.3.10 PCB Transmission Lines
      4. 9.2.4 Application Curves
10. 10Power Supply Recommendations
11. 11Layout
    1. 11.1 Layout Guidelines
       1. 11.1.1 Microstrip vs. Stripline Topologies
       2. 11.1.2 Dielectric Type and Board Construction
       3. 11.1.3 Recommended Stack Layout
       4. 11.1.4 Separation Between Traces
       5. 11.1.5 Crosstalk and Ground Bounce Minimization
       6. 11.1.6 Decoupling
          1.       (a)
          2.       (b)
    2. 11.2 Layout Example
12. 12器件和文檔支持
    1. 12.1 文檔支持
    2. 12.2 接收文檔更新通知
    3. 12.3 支持資源
    4. 12.4 商標(biāo)
    5. 12.5 靜電放電警告
    6. 12.6 Glossary
13. 13機(jī)械、封裝和可訂購(gòu)信息