ZHCSQI5I August 1990 – October 2022 SN55LBC176 , SN65LBC176 , SN75LBC176
PRODUCTION DATA
| THERMAL METRIC(1) | D | P | UNIT | |
|---|---|---|---|---|
| 8 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | 116.7 | 65.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 56.3 | 54.6 | |
| RθJB | Junction-to-board thermal resistance | 63.4 | 42.1 | |
| ψJT | Junction-to-top characterization parameter | 8.8 | 22.9 | |
| ψJB | Junction-to-board characterization parameter | 62.6 | 41.6 | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | |