ZHCSAC4B October 2012 – November 2017 SN65HVD82
PRODUCTION DATA.
6 Specifications
6.1 Absolute Maximum Ratings(1)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| VCC | Supply voltage | –0.5 | 7 | V |
| Voltage range at A or B Inputs | –18 | 18 | V | |
| Input voltage range at any logic pin | –0.3 | 5.7 | V | |
| Voltage input range, transient pulse, A and B, through 100Ω | –100 | 100 | V | |
| Receiver output current | –24 | 24 | mA | |
| TJ | Junction temperature | 170 | °C | |
| Continuous total power dissipation | See Thermal Information | |||
| TSTG | Storage temperature | –65 | 150 | °C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
| VALUE | UNIT | ||||
|---|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±4000 | V | |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1500 | ||||
| Machine model (MM), JEDEC Standard 22 | ±400 | ||||
| IEC 61000-4-2 ESD (Contact Discharge) | Bus terminals and GND | ±12000 | |||
| IEC 60749-26 ESD (Human Body Model) | Bus terminals and GND | ±16000 | |||
| IEC 61000-4-4 EMC (Fast Transient Burst Immunity) | Bus terminals and GND | ±4000 | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
| MIN | NOM | MAX | UNIT | |||
|---|---|---|---|---|---|---|
| VCC | Supply voltage | 4.5 | 5 | 5.5 | V | |
| VI | Input voltage at any bus terminal (separately or common mode)(1) | –7 | 12 | V | ||
| VIH | High-level input voltage (D, DE and RE inputs) | 2 | VCC | V | ||
| VIL | Low-level input voltage (D, DE and RE inputs) | 0 | 0.8 | V | ||
| VID | Differential input voltage (A and B inputs) | –12 | 12 | V | ||
| IO | Output current, Driver | –60 | 60 | mA | ||
| Output current, Receiver | –8 | 8 | mA | |||
| RL | Differential load resistance | 54 | 60 | Ω | ||
| CL | Differential load capacitance | 50 | pF | |||
| 1/tUI | Signaling rate | 250 | kbps | |||
| TA | Operating free-air temperature (see Application and Implementation section for thermal information) | –40 | 85 | °C | ||
| TJ | Junction Temperature | –40 | 150 | °C | ||
(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
6.4 Thermal Information
| THERMAL METRIC(1) | SN65HVD82 | UNIT | |
|---|---|---|---|
| D (SOIC) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 116.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 60.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 57.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 13.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 56.5 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics
over recommended operating conditions (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |||
|---|---|---|---|---|---|---|---|---|
| |VOD| | Driver differential output voltage magnitude | See Figure 5, RL = 60 Ω, 375 Ω on each output to –7 V to 12 V | 1.5 | V | ||||
| RL = 54 Ω (RS-485) | See Figure 6 | 1.5 | 2 | V | ||||
| RL = 100 Ω (RS-422) | 2 | 2.5 | V | |||||
| Δ|VOD| | Change in magnitude of driver differential output voltage | RL = 54 Ω, CL = 50 pF | See Figure 6 | –0.2 | 0 | 0.2 | V | |
| VOC(SS) | Steady-state common-mode output voltage | Center of two 27-Ω load resistors | See Figure 6 | 1 | VCC/2 | 3 | V | |
| ΔVOC | Change in differential driver output common-mode voltage | –0.2 | 0 | 0.2 | V | |||
| VOC(PP) | Peak-to-peak driver common-mode output voltage | 850 | mV | |||||
| COD | Differential output capacitance | 8 | pF | |||||
| VIT+ | Positive-going receiver differential input voltage threshold | See (1) | –70 | -20 | mV | |||
| VIT– | Negative-going receiver differential input voltage threshold | –200 | –150 | See (1) | mV | |||
| VHYS | Receiver differential input voltage threshold hysteresis (VIT+ – VIT–) | 40 | 60 | mV | ||||
| VOH | Receiver high-level output voltage | IOH = -8 mA | 4 | VCC–0.3 | V | |||
| VOL | Receiver low-level output voltage | IOL = 8 mA | 0.2 | 0.4 | V | |||
| II | Driver input, driver enable, and receiver enable input current | –2 | 2 | μA | ||||
| IOZ | Receiver output high-impedance current | VO = 0 V or VCC, RE at VCC | –10 | 10 | µA | |||
| IOS | Driver short-circuit output current | | IOS | with VA or VB from –7 V to +12 V | 150 | mA | ||||
| II | Bus input current (disabled driver) | VCC = 4.5 to 5.5 V or VCC = 0 V, DE at 0 V |
VI = 12 V | 75 | 125 | μA | ||
| VI = –7 V | –100 | –40 | ||||||
| ICC | Supply current (quiescent) | Driver and Receiver enabled | DE = VCC, RE=GND, No load |
900 | μA | |||
| Driver enabled, receiver disabled | DE = VCC, RE = VCC, No load |
650 | ||||||
| Driver disabled, receiver enabled | DE = GND, RE = GND, No load |
650 | ||||||
| Driver and receiver disabled | DE = GND, D=GND, RE = VCC, No load |
0.4 | 2 | |||||
| Supply current (dynamic) | See Typical Characteristics | |||||||
(1) Under any specific conditions, VIT+ is assured to be at least VHYS higher than VIT-.
6.6 Switching Characteristics
over recommended operating conditions (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
|---|---|---|---|---|---|---|---|
| DRIVER | |||||||
| tr, tf | Driver differential output rise/fall time | RL = 54 Ω, CL = 50 pF, See Figure 7 | 400 | 700 | 1200 | ns | |
| tPHL, tPLH | Driver propagation delay | 90 | 700 | 1000 | ns | ||
| tSK(P) | Driver pulse skew, |tPHL – tPLH| | 25 | 200 | ns | |||
| tPHZ, tPLZ | Driver disable time | See Figure 8 and Figure 9 | 50 | 500 | ns | ||
| tPZH, tPZL | Driver enable time | Receiver enabled | 500 | 1000 | ns | ||
| Receiver disabled | 3 | 9 | μs | ||||
| RECEIVER | |||||||
| tr, tf | Receiver output rise/fall time | CL = 15 pF, See Figure 10 | 18 | 30 | ns | ||
| tPHL, tPLH | Receiver propagation delay time | 85 | 195 | ns | |||
| tSK(P) | Receiver pulse skew, |tPHL – tPLH| | 1 | 15 | ns | |||
| tPLZ, tPHZ | Receiver disable time | 50 | 500 | ns | |||
| tPZL(1), tPZH(1)
tPZL(2), tPZH(2) |
Receiver enable time | Driver enabled, See Figure 11 | 20 | 130 | ns | ||
| Driver disabled, See Figure 12 | 2 | 8 | μs | ||||
6.7 Typical Characteristics
Figure 1. Driver Output Voltage vs Driver Output Current
Figure 3. Supply Current vs Signaling Rate
Figure 2. Driver Rise and Fall Time vs Temperature
Figure 4. Receiver Output vs Differential Input Voltage