ZHCSRU5F September 2005 – March 2023 SN65HVD50 , SN65HVD51 , SN65HVD52 , SN65HVD53 , SN65HVD54 , SN65HVD55
PRODUCTION DATA
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
|---|---|---|---|---|---|---|---|
| θJA | Junction?to?ambient thermal resistance | Low-K board | HVD51 | 230.8 | °C/W | ||
| HVD53, HVD54, HVD55, HVD52, HVD50 | - | ||||||
| Junction?to?ambient thermal resistance | High-K board | HVD51 | 135.1 | ||||
|
HVD50, HVD52 |
116.7 | ||||||
| HVD53, HVD54, HVD55 | 93.2 | ||||||
| θJB | Junction?to?board thermal resistance | High-K board | HVD51 | 44.4 | |||
| HVD50, HVD52 | 63.4 | ||||||
| HVD53, HVD54, HVD55 | 49.4 | ||||||
| θJC | Junction?to?case thermal resistance | No board | HVD51 | 43.5 | |||
| HVD50, HVD52 | 56.3 | ||||||
| HVD53, HVD54, HVD55 | 47.5 | ||||||
| PD | Device power dissipation | RL= 60?, CL = 50 pF, Input to D a 50% duty cycle square wave at indicated signaling rate |
HVD50 (25Mbps) | 420 | mW | ||
| HVD51 (10Mbps) | 404 | ||||||
| HVD52 (1Mbps) | 383 | ||||||
| RL= 60?, CL = 50 pF, DE at VCCRE at 0 V, Input to D a 50% duty cycle square wave at indicated signaling rate |
HVD53 (25Mbps) | 420 | |||||
| HVD54 (10Mbps) | 404 | ||||||
| HVD55 (1Mbps) | 383 | ||||||
| TA | Ambient air temperature | Low-K board, No airflow | HVD50 | –40 | 55 | °C | |
| HVD51, HVD52 | –40 | 84 | |||||
| HVD53, HVD54, HVD55 | –40 | 85 | |||||
| High-K board, No airflow | HVD50, HVD51, HVD52 | –40 | 85 | ||||
| HVD53, HVD54, HVD55 | –40 | 85 | |||||
| TJSD | Thermal shutdown junction temperature | 165 | |||||