ZHCSRQ0F june 2004 – february 2023 SN65HVD485E
PRODUCTION DATA
| THERMAL METRIC(1) | SN65HVD485E | UNIT | ||||
|---|---|---|---|---|---|---|
| D (SOIC) | DGK (VSSOP) | P (PDIP) | ||||
| 8 PINS | 8 PINS | 8 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance(2) | 116.7 | 137.8 | 84.3 | °C/W | |
| RθJC(top) | Junction-to-case (top) thermal resistance | 56.3 | 31.2 | 65.4 | °C/W | |
| RθJB | Junction-to-board thermal resistance | 63.4 | 71.7 | 62.1 | °C/W | |
| ψJT | Junction-to-top characterization parameter | 8.8 | 0.6 | 31.3 | °C/W | |
| ψJB | Junction-to-board characterization parameter | 62.6 | 70.5 | 60.4 | °C/W | |