ZHCSRU3J January 2008 – March 2023 SN65HVD1785 , SN65HVD1786 , SN65HVD1787 , SN65HVD1791 , SN65HVD1792 , SN65HVD1793
PRODUCTION DATA
| THERMAL METRIC(1) | SN65HVD1785, SN65HVD1786, SN65HVD1787 | SN65HVD1791, SN65HVD1792, SN65HVD1793 | UNIT | |||
|---|---|---|---|---|---|---|
| D (SOIC) | P (PDIP) | D (SOIC) | ||||
| 8 PINS | 8 PINS | 14 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | 138 | 59 | 95 | °C/W | |
| RθJA (low-K) | Junction-to-case (top) thermal resistance | 242 | 128 | 168 | °C/W | |
| RθJC(top) | Junction-to-board thermal resistance | 61 | 61 | 44 | °C/W | |
| RθJB | Junction-to-top characterization parameter | 62 | 39 | 40 | °C/W | |
| ψJT | Junction-to-board characterization parameter | 3.4 | 17.6 | 8.2 | °C/W | |
| ψJB | Junction-to-case (bottom) thermal resistance | 33.4 | 28.3 | 25 | °C/W | |