ZHCSRU6F May 2002 – March 2023 SN65HVD05 , SN65HVD06 , SN65HVD07 , SN75HVD05 , SN75HVD06 , SN75HVD07
PRODUCTION DATA
| THERMAL METRIC(1) | D
(SOIC) SN65 Variation |
D (SOIC) SN75 Variation |
P (PDIP) | UNIT | |
|---|---|---|---|---|---|
| 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 116.7 | 175.4 | 125 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 56.3 | 53.6 | 34.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 63.4 | 45.1 | 23.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 8.8 | 10.1 | 12.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 62.6 | 44.4 | 23.6 | °C/W |