ZHCSPX1C March 2003 – June 2022 SN54HC109 , SN74HC109
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC | D (SOIC) | N (PDIP) | NS (SO) | UNIT | |
|---|---|---|---|---|---|
| 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance(1) | 117.2 | 60.5 | 88.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 77.2 | 47.9 | 45.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 75.6 | 40.4 | 50.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 38.1 | 27.3 | 12.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 75.3 | 40.2 | 50.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |