ZHCSK05D July 2019 – October 2022 SN3257-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | DEVICE | DEVICE | UNIT | |
|---|---|---|---|---|
| PW (TSSOP) | DYY (SOT-23) | |||
| 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 117.4 | 123.0 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 47.9 | 70.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 63.7 | 50.4 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 6.9 | 5.0 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 63.1 | 50.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |