SBOS392H August 2007 – August 2019 REF3312 , REF3318 , REF3320 , REF3325 , REF3330 , REF3333
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Device Comparison
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Parameter Measurement Information
- 9 Detailed Description
-
10Applications and Implementation
- 10.1 Application Information
- 10.2
Typical Applications
- 10.2.1
REF3312 in a Bipolar Signal-Chain Configuration
- 10.2.1.1 Design Requirements
- 10.2.1.2 Detailed Design Procedure
- 10.2.1.3 Application Curves
- 10.2.1
REF3312 in a Bipolar Signal-Chain Configuration
- 11Power-Supply Recommendations
- 12Layout
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
封裝選項
機械數據 (封裝 | 引腳)
散熱焊盤機械數據 (封裝 | 引腳)
訂購信息
9.3.3 Power Dissipation
The REF33xx family is specified to deliver current loads of ±5 mA over the specified input voltage range. The temperature of the device increases according to Equation 3:
Equation 3. 
where
- TJ = junction temperature (°C).
- TA = ambient temperature (°C).
- PD = power dissipation (W) = VIN × IQ + (VIN – VOUT) IOUT.
- RθJA = Junction-to-ambient thermal resistance (°C/W).
The REF33xx junction temperature must not exceed the absolute maximum rating of 150°C.