ZHCS094A September 2008 – November 2014 PCM3070
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 LP38690 的
- 5 修訂歷史記錄
- 6 Device Comparison Table
- 7 Pin Configuration and Functions
-
8 Specifications
- 8.1 Absolute Maximum Ratings
- 8.2 Handling Ratings
- 8.3 Recommended Operating Conditions
- 8.4 Thermal Information
- 8.5 Electrical Characteristics, ADC
- 8.6 Electrical Characteristics, Bypass Outputs
- 8.7 Electrical Characteristics, Audio DAC Outputs
- 8.8 Electrical Characteristics, LDO
- 8.9 Electrical Characteristics, Misc.
- 8.10 Electrical Characteristics, Logic Levels
- 8.11 I2S LJF and RJF Timing in Master Mode (see )
- 8.12 I2S LJF and RJF Timing in Slave Mode (see )
- 8.13 DSP Timing in Master Mode (see )
- 8.14 DSP Timing in Slave Mode (see )
- 8.15 I2C Interface Timing
- 8.16 SPI Interface Timing (See )
- 8.17 Typical Characteristics
- 9 Parameter Measurement Information
- 10Detailed Description
- 11Application and Implementation
- 12Power Supply Recommendations
- 13Layout
- 14器件和文檔支持
- 15機(jī)械封裝和可訂購(gòu)信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RHB|32
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RHB|32
訂購(gòu)信息
14 器件和文檔支持
14.1 文檔支持
14.1.1 相關(guān)文檔
《PCM3070 應(yīng)用參考指南》，SLAU332。
14.2 商標(biāo)
All trademarks are the property of their respective owners.
14.3 靜電放電警告
這些裝置包含有限的內(nèi)置 ESD 保護(hù)。 存儲(chǔ)或裝卸時(shí)，應(yīng)將導(dǎo)線一起截短或?qū)⒀b置放置于導(dǎo)電泡棉中，以防止 MOS 門極遭受靜電損傷。
14.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.