ZHCSFL9 October   2016 OPT3006

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
4. 4 修訂歷史記錄
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Electrical Characteristics
   6. 6.6 Timing Requirements
   7. 6.7 Typical Characteristics
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Human Eye Matching
      2. 7.3.2 Automatic Full-Scale Range Setting
      3. 7.3.3 Interrupt Operation, INT Pin, and Interrupt Reporting Mechanisms
      4. 7.3.4 I2C Bus Overview
         1. 7.3.4.1 Serial Bus Address
         2. 7.3.4.2 Serial Interface
   4. 7.4 Device Functional Modes
      1. 7.4.1 Automatic Full-Scale Setting Mode
      2. 7.4.2 Interrupt Reporting Mechanism Modes
         1. 7.4.2.1 Latched Window-Style Comparison Mode
         2. 7.4.2.2 Transparent Hysteresis-Style Comparison Mode
         3. 7.4.2.3 End-of-Conversion Mode
         4. 7.4.2.4 End-of-Conversion and Transparent Hysteresis-Style Comparison Mode
   5. 7.5 Programming
      1. 7.5.1 Writing and Reading
         1. 7.5.1.1 High-Speed I2C Mode
         2. 7.5.1.2 General-Call Reset Command
         3. 7.5.1.3 SMBus Alert Response
   6. 7.6 Register Maps
      1. 7.6.1 Internal Registers
         1. 7.6.1.1 Register Descriptions
            1. 7.6.1.1.1 Result Register (offset = 00h)
            2. 7.6.1.1.2 Configuration Register (offset = 01h) [reset = C810h]
            3. 7.6.1.1.3 Low-Limit Register (offset = 02h) [reset = C0000h]
            4. 7.6.1.1.4 High-Limit Register (offset = 03h) [reset = BFFFh]
            5. 7.6.1.1.5 Manufacturer ID Register (offset = 7Eh) [reset = 5449h]
            6. 7.6.1.1.6 Device ID Register (offset = 7Fh) [reset = 3001h]
8. 8 Application and Implementation
   1. 8.1 Application Information
      1. 8.1.1 Electrical Interface
      2. 8.1.2 Optical Interface
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
         1. 8.2.2.1 Optomechanical Design
      3. 8.2.3 Application Curves
   3. 8.3 Do's and Don'ts
9. 9 Power-Supply Recommendations
10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Soldering and Handling Recommendations
       1. 10.2.1 Solder Paste
       2. 10.2.2 Package Placement
       3. 10.2.3 Reflow Profile
       4. 10.2.4 Special Flexible Printed Circuit Board (FPCB) Recommendations
       5. 10.2.5 Rework Process
    3. 10.3 Layout Example
11. 11器件和文檔支持
    1. 11.1 文檔支持
       1. 11.1.1 相關(guān)文檔　
    2. 11.2 接收文檔更新通知
    3. 11.3 社區(qū)資源
    4. 11.4 商標(biāo)
    5. 11.5 靜電放電警告
    6. 11.6 Glossary
12. 12機(jī)械、封裝和可訂購(gòu)信息