ZHCSMS9J September 1973 – February 2025 NA555 , NE555 , SA555 , SE555
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | NA556, NE556, SA555, SE555 | SE555 | NA555, NE555 | NE555 | UNIT | |||
|---|---|---|---|---|---|---|---|---|
| D (SOIC) |
FK (LCCC) |
JG (CDIP) |
P (PDIP) |
PS (SO) |
PW (TSSOP) |
|||
| 8 PINS | 20 PINS | 8 PINS | 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 125.4 | 92.2 | 125.0 | 98.5 | 124.5 | 164.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 64.9 | 67.6 | 73.3 | 77.8 | 61.2 | 70.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 73.2 | 66.7 | 114.9 | 61.0 | 79.3 | 104.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 14.3 | 61.6 | 44.4 | 43.9 | 16.5 | 8.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 72.1 | 66.5 | 106.6 | 60.3 | 77.8 | 103.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 14.2 | 29.3 | N/A | N/A | N/A | °C/W |