ZHCSAZ8K January 2005 – January 2016 LP38691-ADJ , LP38691-ADJ-Q1 , LP38693-ADJ , LP38693-ADJ-Q1
PRODUCTION DATA.
- 1 特性
- 2 應用范圍
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
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8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Applications
- 8.2.1 Design Requirements
- 8.2.2 Detailed Design Procedure
- 8.2.3 Application Curve
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機械、封裝和可訂購信息
11 器件和文檔支持
11.1 文檔支持
11.1.1 相關文檔
相關文檔如下：
- 《無引線框架封裝 (LLP)》（文獻編號：SNOA401）
- 《半導體和 IC 封裝熱指標》(SPRA953)
- 《使用新的熱指標》（文獻編號：SBVA025）
- 《采用 JEDEC PCB 設計的線性和邏輯封裝散熱特性》(SZZA017)
11.2 相關鏈接
Table 2 列出了快速訪問鏈接。范圍包括技術文檔、支持和社區資源、工具和軟件，以及樣片或購買的快速訪問。
11.3 社區資源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
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TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
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Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
11.4 商標
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 靜電放電警告
這些裝置包含有限的內置 ESD 保護。 存儲或裝卸時，應將導線一起截短或將裝置放置于導電泡棉中，以防止 MOS 門極遭受靜電損傷。
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.