ZHCSU09I July 2004 – February 2025 LP2981 , LP2981A
PRODUCTION DATA
| THERMAL METRIC (1) | Legacy Chip (2) | New Chip (2) | UNIT | |
|---|---|---|---|---|
| DBV (SOT23-5) | DBV (SOT23-5) | |||
| 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 205.2 | 178.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 11.83 | 77.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 37.7 | 47.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 12.2 | 15.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 33.8 | 46.9 | °C/W |