ZHCSSL3R April   2000  – February 2025 LP2980-N

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 應(yīng)用
4. 3 說明
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1 Absolute Maximum Ratings
   2. 5.2 ESD Ratings
   3. 5.3 Recommended Operating Conditions
   4. 5.4 Thermal Information
   5. 5.5 Electrical Characteristics
   6. 5.6 Typical Characteristics
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagram
   3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Output Pulldown
      6. 6.3.6 Thermal Shutdown
   4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
8. 7 Application and Implementation
   1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
         1. 7.1.1.1 Recommended Output Capacitors (Legacy Chip)
            1. 7.1.1.1.1 Tantalum Capacitors (Legacy Chip)
            2. 7.1.1.1.2 Aluminum Electrolytic Capacitors (Legacy Chip)
            3. 7.1.1.1.3 Multilayer Ceramic Capacitors (Legacy Chip)
         2. 7.1.1.2 Recommended Output Capacitors (New Chip)
      2. 7.1.2 Input Capacitor Requirements
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Reverse Current
   2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
         1. 7.2.2.1 ON/OFF Input Operation
      3. 7.2.3 Application Curves
   3. 7.3 Power Supply Recommendations
   4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
9. 8 Device and Documentation Support
   1. 8.1 Device Support
      1. 8.1.1 第三方產(chǎn)品免責(zé)聲明
      2. 8.1.2 Device Nomenclature
   2. 8.2 接收文檔更新通知
   3. 8.3 支持資源
   4. 8.4 Trademarks
   5. 8.5 靜電放電警告
   6. 8.6 術(shù)語表
10. 9 Revision History
11. 10Mechanical, Packaging, and Orderable Information