ZHCSOM1K April   2006  – December 2024 LP2950 , LP2951

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 應(yīng)用
4. 3 說(shuō)明
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1 Absolute Maximum Ratings
   2. 5.2 ESD Ratings
   3. 5.3 Recommended Operating Conditions
   4. 5.4 Thermal Information
   5. 5.5 Electrical Characteristics (Both Legacy and New Chip)
   6. 5.6 Timing Requirements (New Chip only)
   7. 5.7 Typical Characteristics
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagrams
   3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Thermal Shutdown
   4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
8. 7 Application and Implementation
   1. 7.1 Application Information
      1. 7.1.1 Reverse Current
      2. 7.1.2 Input and Output Capacitor Requirements
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
   2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
         1. 7.2.1.1 Recommended Capacitor Types
            1. 7.2.1.1.1 Recommended Capacitors for the Legacy Chip
               1. 7.2.1.1.1.1 ESR Range (Legacy Chip)
            2. 7.2.1.1.2 Recommended Capacitors for the New Chip
      2. 7.2.2 Detailed Design Procedure
         1. 7.2.2.1 Feedback Resistor Selection
         2. 7.2.2.2 Feedforward Capacitor
      3. 7.2.3 Application Curve
   3. 7.3 Power Supply Recommendations
   4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
9. 8 Device and Documentation Support
   1. 8.1 Device Support
      1. 8.1.1 Development Support
   2. 8.2 接收文檔更新通知
   3. 8.3 Device Nomenclature
   4. 8.4 Documentation Support
      1. 8.4.1 Related Documentation
   5. 8.5 支持資源
   6. 8.6 Trademarks
   7. 8.7 靜電放電警告
   8. 8.8 術(shù)語(yǔ)表
10. 9 Revision History
11. 10Mechanical, Packaging, and Orderable Information