ZHCSHQ3F August 2017 – November 2020 LMR33630
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Detailed Description
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Application
- 9.2.1 Design Requirements
- 9.2.2
Detailed Design Procedure
- 9.2.2.1 Custom Design With WEBENCH? Tools
- 9.2.2.2 Choosing the Switching Frequency
- 9.2.2.3 Setting the Output Voltage
- 9.2.2.4 Inductor Selection
- 9.2.2.5 Output Capacitor Selection
- 9.2.2.6 Input Capacitor Selection
- 9.2.2.7 CBOOT
- 9.2.2.8 VCC
- 9.2.2.9 CFF Selection
- 9.2.2.10 External UVLO
- 9.2.2.11 Maximum Ambient Temperature
- 9.2.3 Application Curves
- 9.3 What to Do and What Not to Do
- 10Layout
- 11Device and Documentation Support
封裝選項
請參考 PDF 數據表獲取器件具體的封裝圖。
機械數據 (封裝 | 引腳)
- RNX|12
- DDA|8
散熱焊盤機械數據 (封裝 | 引腳)
訂購信息
10.2 Layout Example
Figure 10-2 Example Layout for HSOIC (DDA) Package
Figure 10-3 Example Layout for VQFN
Package