ZHCSJW8D October 2011 – June 2019 LMR10515
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 修訂歷史記錄
- 5 說明（續）
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Detailed Description
- 9 Application and Implementation
- 10Layout
- 11器件和文檔支持
- 12機械、封裝和可訂購信息
10.4 WSON Package
Figure 27. Internal WSON Connection For certain high power applications, the PCB land may be modified to a "dog bone" shape (see ). By increasing the size of ground plane, and adding thermal vias, the RθJA for the application can be reduced.