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ZHCSJW8D October 2011 – June 2019 LMR10515

PRODUCTION DATA.

封裝選項

機械數據 (封裝 | 引腳)

NGG|6
- MPDS395
DBV|5
- MPDS018T

散熱焊盤機械數據 (封裝 | 引腳)

訂購信息

7.3 Electrical Characteristics

VIN = 5V unless otherwise indicated under the conditions column. Limits in standard type are for T_J = 25°C only; limits in boldface type apply over the junction temperature (T_J) range of -40°C to +125°C. Minimum and maximum limits are ensured through test, design, or statistical correlation. Typical values represent the most likely parametric norm at T_J = 25°C, and are provided for reference purposes only.⁽²⁾⁽³⁾

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
V_FB	Feedback Voltage		0.588	0.600	0.612	V
ΔV_FB/V_IN	Feedback Voltage Line Regulation	V_IN = 3V to 5V		0.02		%/V
I_B	Feedback Input Bias Current			0.1	100	nA
UVLO	Undervoltage Lockout	V_IN Rising		2.73	2.90	V
	Undervoltage Lockout	V_INFalling	1.85	2.3
	UVLO Hysteresis			0.43		V
F_SW	Switching Frequency	LMR10515-X	1.2	1.6	1.95	MHz
F_SW	Switching Frequency	LMR10515-Y	2.25	3.0	3.75	MHz
D_MAX	Maximum Duty Cycle	LMR10515-X	86	94		%
D_MAX	Maximum Duty Cycle	LMR10515-Y	82	90		%
D_MIN	Minimum Duty Cycle	LMR10515-X		5		%
D_MIN	Minimum Duty Cycle	LMR10515-Y		7		%
R_DS(ON)	Switch On Resistance	WSON Package		150		mΩ
R_DS(ON)	Switch On Resistance	SOT-23 Package		130	195	mΩ
I_CL	Switch Current Limit	V_IN = 3.3V	1.8	2.5		A
V_{EN_TH}	Shutdown Threshold Voltage				0.4	V
V_{EN_TH}	Enable Threshold Voltage		1.8			V
I_SW	Switch Leakage			100		nA
I_EN	Enable Pin Current	Sink/Source		100		nA
I_Q	Quiescent Current (switching)	LMR10515X V_FB = 0.55		3.3	5	mA
	Quiescent Current (switching)	LMR10515Y V_FB = 0.55		4.3	6.5	mA
	Quiescent Current (shutdown)	All Options V_EN = 0V		30		nA
θ_JA	Junction to Ambient 0 LFPM Air Flow⁽⁴⁾	WSON Package		80		°C/W
θ_JA	Junction to Ambient 0 LFPM Air Flow⁽⁴⁾	SOT-23 Package		118		°C/W
θ_JC	Junction to Case	WSON Package		18		°C/W
θ_JC	Junction to Case	SOT-23 Package		80		°C/W
T_SD	Thermal Shutdown Temperature			165		°C

(1) Thermal shutdown occurs if the junction temperature exceeds the maximum junction temperature of the device.

(2) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate TI's Average Outgoing Quality Level (AOQL).

(3) Typical numbers are at 25°C and represent the most likely parametric norm.

(4) Applies for packages soldered directly onto a 3-inch x 3-inch PC board with 2 oz. copper on 4 layers in still air.