4 修訂歷史

Changes from F Revision (May 2013) to G Revision

• Added 引腳配置和功能部分，ESD 額定值表，特性描述部分，器件功能模式，應用和實施部分，電源相關建議部分，布局部分，器件和文檔支持部分以及機械、封裝和可訂購信息部分Go

Changes from E Revision (February 2013) to F Revision

• Added 器件名稱至文檔標題。Go
• Changed 所有 LLP 和 QFN 封裝至 WQFN 封裝（通篇）。Go
• Deleted optional from CLKin* pin description. And changed complimentary to complementary.Go
• Added max limit to Output Skew parameter and added tablenote to parameter in Electrical Characteristics Table.Go
• Changed typical value for both conditions of Propagation Delay in the Electrical Characteristics Table.Go
• Added Min/Max limits to both conditions of Propagation Delay parameter in Electrical Characteristics Table.Go
• Changed unit value for the first condition of Part-to-part Skew from ps to ns in the Electrical Characteristics Table.Go
• Changed both Max values of each Part-to-part Skew condition in Electrical Characteristics Table.Go
• Changed the Typ value of each Rise/Fall Time condition in the Electrical Characteristics Table. Go
• Deleted V_IL table note.Go
• Added V_{I_SE} parameter and spec limits with corresponding table note to Electrical Characteristics Table.Go
• Added CLKin* column to CLKin Input vs. Output States table. Also added fourth row starting with Logic Low under CLKin column.Go
• Changed table title from CLKin input vs. Output States to OSCin Input vs. Output StatesGo
• Changed third paragraph in Driving the Clock Inputs section to include CLKin* and LVCMOS text. Removed extra references to other figures. Revised to better correspond with information in Electrical Characteristics Table.Go
• Deleted Figure 10 (Near End termination) and Figure 11 (Far End termination) from Driving the Clock Inputs sectionGo
• Changed bypass cap text to signal attenuation text of the fourth paragraph in Driving the Clock Inputs section.Go
• Changed Single-Ended LVCMOS Input, DC Coupling with Common Mode Biasing image with revised graphic.Go
• Deleted sentence in reference to two deleted images.Go
• Changed link from National packaging site to TI packaging site.Go