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SNLS312M August 2010 – July 2015 LMH0394

PRODUCTION DATA.

封裝選項

機械數據 (封裝 | 引腳)

RUM|16
- MPQF223A

散熱焊盤機械數據 (封裝 | 引腳)

RUM|16
- QFND453A

訂購信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

	MIN	MAX	UNIT
Supply voltage		3.1	V
Input voltage (all inputs)	–0.3	V_CC + 0.3	V
Junction temperature		125	°C
Storage temperature, T_stg	–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±6000	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±2000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

	MIN	NOM	MAX	UNIT
Supply voltage (V_CC – V_EE)	2.375	2.5	2.625	V
Input coupling capacitance		1		µF
Operating free-air temperature (T_A)	–40	25	85	°C

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		LMH0394	UNIT
		RUM (WQFN)
		16 PINS
R_θJA	Junction-to-ambient thermal resistance	40	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	6	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 DC Electrical Characteristics

over supply voltage and operating temperature ranges, unless otherwise specified⁽¹⁾⁽²⁾.

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
V_IH	Input voltage high level	Logic inputs	1.7		V_CC	V
V_IL	Input voltage low level	Logic inputs	V_EE		0.7	V
V_SDI	Input voltage swing	0m cable length⁽³⁾ (SDI)	720	800	880	mV_P−P
V_CMIN	Input common-mode voltage			1.65		V
V_SSP-P	Differential output voltage, P-P	100-Ω load, default register settings, Figure 1⁽⁴⁾ (SDO, SDO)	500	700	900	mV_P-P
V_OD	Differential output voltage		250	350	450	mV
ΔV_OD	Change in magnitude of V_OD for complementary output states				50	mV
V_OS	Offset voltage		1.1	1.2	1.35	V
ΔV_OS	Change in magnitude of V_OS for complementary output states				50	mV
I_OS	Output short circuit current				30	mA
MUTE_REF	MUTE_REF DC voltage (floating)	MUTE_REF		1.3		V
MUTE_RNG	MUTE_REF range	MUTE_REF		0.8		V
V_OH	Output voltage high level	I_OH = -2 mA (CD, MISO)	2.0			V
V_OL	Output voltage low level	I_OL = +2 mA (CD, MISO)			0.2	V
I_CC	Supply current	Normal operation⁽⁵⁾		45	65	mA
I_CC	Supply current	Power-save mode		7	10	mA

(1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated referenced to V_EE = 0 Volts.

(2) Typical values are stated for V_CC = 2.5 V and T_A = 25°C.

(3) The LMH0394 can be optimized for different launch amplitudes through the SPI.

(4) The differential output voltage and offset voltage are adjustable through the SPI.

(5) Typical I_CC is measured with a 2.97 Gbps input signal.

6.6 AC Electrical Characteristics

over supply voltage and operating temperature ranges, unless otherwise specified⁽¹⁾.

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
BR_MIN	Minimum input data rate	SDI, SDI		125		Mbps
BR_MAX	Maximum input data rate	SDI, SDI			2970	Mbps
TJ_RAW	Jitter for various cable lengths	2.97 Gbps, Belden 1694A, 0-100 meters⁽²⁾			0.2	UI
		2.97 Gbps, Belden 1694A, 100-140 meters⁽²⁾			0.3	UI
		2.97 Gbps, Belden 1694A, 140-180 meters⁽²⁾			0.5	UI
		2.97 Gbps, Belden 1694A, 180-200 meters		0.55		UI
		1.485 Gbps, Belden 1694A, 0-200 meters⁽²⁾			0.2	UI
		1.485 Gbps, Belden 1694A, 200-220 meters		0.3		UI
		270 Mbps, Belden 1694A, 0-400 meters⁽²⁾			0.3	UI
t_R, t_F	Output rise time, fall time	SDO, SDO, 20% – 80%, and 100-Ω load Figure 1⁽³⁾		90	130	ps
ΔT_{R_F}	Mismatch in rise / fall time	SDO, SDO ⁽³⁾		2	15	ps
t_OS	Output overshoot	SDO, SDO⁽³⁾		1%	5%
RL_IN	Input return loss	5 MHz - 1.5 GHz⁽⁴⁾ SDI or SDI	15			dB
RL_IN	Input return loss	1.5 GHz - 3.0 GHz⁽⁴⁾ SDI or SDI	10			dB
R_IN	Input resistance	single-ended SDI or SDI		1.5		kΩ
C_IN	Input capacitance	single-ended SDI or SDI		0.7		pF

(1) Typical values are stated for V_CC = 2.5 V and T_A = 25°C.

(2) Based on design and characterization data over the full range of recommended operating conditions of the device. Jitter is measured in accordance with ST RP 184, ST RP 192, and the applicable serial data transmission standard: ST 424, ST 292, or ST 259.

(3) Specification is ensured by characterization.

(4) Input return loss is dependent on board design. The LMH0394 exceeds this specification on the SD394EVK evaluation board with a return loss network consisting of a 5.6-nH inductor in parallel with a 75-Ω series resistor on the input.

6.7 SPI Interface AC Electrical Characteristics

over supply voltage and operating temperature ranges, unless otherwise specified⁽¹⁾.

PARAMETER		TEST CONDITIONS	MIN	MAX	UNIT
Recommended Input Timing Requirements
f_SCK	SCK frequency			20	MHz
t_PH	SCK pulse width high	See Figure 2 and Figure 3	40		% SCK period
t_PL	SCK pulse width low	See Figure 2 and Figure 3	40		% SCK period
t_SU	MOSI set-up time	See Figure 2Figure 3	4		ns
t_H	MOSI hold time	See Figure 2Figure 3	4		ns
t_SSSU	SS set-up time	See Figure 2 and Figure 3	14		ns
t_SSH	SS hold time		4		ns
t_SSOF	SS OFF-time		1		SCK period
Switching Characteristics
t_ODZ	MISO driven-to-TRI-STATE time	See Figure 3		20	ns
t_OZD	MISO TRI-STATE-to-driven time			10	ns
t_OD	MISO output delay time			15	ns

(1) Typical values are stated for V_CC = 2.5 V and T_A = 25°C.

(2) Due to SMPTE naming convention, all SMPTE Engineering Documents will be numbered as a two-letter prefix and a number. Documents and references with the same root number and year are functionally identical; for example ST 424-2006 and SMPTE 424M-2006 refer to the same document.

Figure 1. LVDS Output Voltage, Offset, and Timing Parameters

Figure 2. SPI Write

Figure 3. SPI Read

6.8 Typical Characteristics

Figure 4. Differential Serial Data Output After Equalizing 161 Meters of Belden 1694A at 2.97 Gbps, PRBS10 Pattern

Figure 5. Differential Serial Data Output After Equalizing 400 Meters of Belden 1694A at 270 Mbps, PRBS10 Pattern