ZHCSMC1B october 2020 – august 2023 LM5157-Q1 , LM51571-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | LM5157x-Q1 | UNIT | |
|---|---|---|---|
| RTE(QFN) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance (LM5157EVM-BST) | 32.7 | °C/W |
| RθJA | Junction-to-ambient thermal resistance | 45.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 45.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 20.0 | °C/W |
| ΨJT | Junction-to-top characterization parameter (LM5157EVM-BST) | 0.6 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.8 | °C/W |
| ΨJB | Junction-to-board characterization parameter (LM5157EVM-BST) | 14.8 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 20.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 6.9 | °C/W |