ZHCSNW4 October 2022 LM5012-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | DDA (SOIC) | UNIT | |
|---|---|---|---|
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance (LM5013-Q1 EVM) | 29.0 | °C/W |
| RθJA | Junction-to-ambient thermal resistance | 34.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 22.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 9.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 9.4 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |