ZHCSNT4I February 2006 – May 2021 LM5009
PRODUCTION DATA
| THERMAL METRIC(1) | LM5009 | UNIT | ||
|---|---|---|---|---|
| DGK (VSSOP) | NGU (WSON) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 157.7 | 42.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 50.2 | 41.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 77.9 | 20.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 4.5 | 0.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 76.5 | 20.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | 4.5 | °C/W |