4 Revision History
Changes from D Revision (May 2013) to E Revision
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Added Applications section, Device Information table, Pin Configuration and Functions section, ESD Ratings table, Recommended Operating Conditions table, Typical Characteristics section, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
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Deleted DSBGA Package references throughout the data sheetGo
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Deleted soldering information rows from Absolute Maximum Ratings tableGo
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Added Thermal Information tableGo
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Changed RθJA values for D (SOIC) package From: 180 To: 111.3 and for LP (TO-92) package From: 160 To: 156.9Go
Changes from C Revision (May 2013) to D Revision
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Changed layout of National Semiconductor Data Sheet to TI formatGo