4 Revision History
Changes from I Revision (April 2013) to J Revision
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Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
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Deleted information re: obsolete CDIP and CLGA package options ; Change pin names from Vin, Vout to IN, OUT; delete Heatsinking sections re: packages apart from TO-220Go
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Changed symbols for Thermal Information Go
Changes from H Revision (April 2013) to I Revision