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SLVS075J April 1989 – January 2015 LM285-1.2 , LM385-1.2 , LM385B-1.2

PRODUCTION DATA.

封裝選項

請參考 PDF 數據表獲取器件具體的封裝圖。

機械數據 (封裝 | 引腳)

D|8
LP|3

散熱焊盤機械數據 (封裝 | 引腳)

訂購信息

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

		MIN	MAX	UNIT
I_R	Reverse Current		30	mA
I_F	Forward Current		10	mA
T_J	Operating virtual junction temperature		150	°C
T_stg	Storage temeprature	–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾	±2000	V
V_(ESD)	Electrostatic discharge	Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾	±1000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

			MIN	MAX	UNIT
I_ZZ	Reference current		0.01	20	mA
T_A	Operating free-air temperature	LM285-1.2	–40	85	°C
T_A	Operating free-air temperature	LM385-1.2, LM385B-1.2	0	70	°C

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		LMx85-1.2				UNIT
		D	LP	PS	PW
		8 PINS	3 PINS	8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	97	140	95	149	°C/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER		TEST CONDITIONS	T_A⁽¹⁾	LM285-1.2			LM385-1.2			LM385B-1.2			UNIT
PARAMETER		TEST CONDITIONS	T_A⁽¹⁾	MIN	TYP	MAX	MIN	TYP	MAX	MIN	TYP	MAX	UNIT
V_Z	Reference voltage	I_Z = I(min) to 20 mA⁽²⁾	25°C	1.223	1.235	1.247	1.21	1.235	1.26	1.223	1.235	1.247	V
α_VZ	Average temperature coefficient of reference voltage⁽³⁾	I_Z = I(min) to 20 mA⁽²⁾	Full Range		±20			±20			±20		ppm/°C
Δ_VZ	Change in reference voltage with current	I_Z = I(min) to 1 mA⁽²⁾	25°C			1			1			1	mV
		I_Z = I(min) to 1 mA⁽²⁾	Full Range			1.5			1.5			1.5
		I_Z = I(min) to 20 mA	25°C			12			20			20
		I_Z = I(min) to 20 mA	Full Range			30			30			30
ΔV_Z/Δt	Long-term change in reference voltage	I_Z = 100 µA	25°C		±20			±20			±20		ppm/khr
I_Z(min)	Minimum reference current		Full Range		8	10		8	15		8	15	µA
Z_Z	Reference impedance	I_Z = 100 µA, f = 25 Hz	25°C		0.2	0.6		0.4	1		0.4	1	Ω
Z_Z	Reference impedance	I_Z = 100 µA, f = 25 Hz	Full Range			1.5			1.5			1.5	Ω
V_n	Broadband noise voltage	I_Z = 100 µA, f = 10 Hz to 10 kHz	25°C		60			60			60		µV

(1) Full range is −40°C to 85°C for the LM285-1.2 and 0°C to 70°C for the LM385-1.2 and LM385B-1.2.

(2) I(min) = 10 μA for the LM285-1.2 and 15 μA for the LM385-1.2 and LM385B-1.2

(3) The average temperature coefficient of reference voltage is defined as the total change in reference voltage divided by the specified temperature range.

7.6 Typical Characteristics

Figure 1. Reverse Current vs Reverse Voltage

Figure 2. Reference Voltage Change vs Reverse Current

Figure 3. Forward Voltage vs Forward Current

Figure 5. Reference Impedance vs Reference Current

Figure 7. Output Noise Voltage vs Cutoff Frequency

Figure 4. Reference Voltage vs Free-Air Temperature

Figure 6. Noise Voltage vs Frequency