10.3 Thermal Considerations
When designing for thermal performance, one must consider many variables:
- Ambient temperature: The surrounding maximum air temperature is fairly explanatory. As the temperature increases, the junction temperature increases. This may not be linear though. As the surrounding air temperature increases, resistances of semiconductors, wires and traces increase. This decreases the efficiency of the application, and more power is converted into heat, increasing the silicon junction temperatures further.
- Forced airflow: Forced air can drastically reduce the device junction temperature. Air flow reduces the hot spots within a design. Warm airflow is often much better than a lower ambient temperature with no airflow.
- External components: Choose components that are efficient, and you can reduce the mutual heating between devices.