SNVS026O March 2000 – June 2016 LM2679
PRODUCTION DATA.
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
The LM2679 is offered in the 14-lead VSON surface mount package to allow for a significantly decreased footprint with equivalent power dissipation compared to the DDPAK.
The Die Attach Pad (DAP) can and must be connected to PCB Ground plane or island. For CAD and assembly guidelines, refer to AN-1187 Leadless Leadfram Package (LLP).