4 Revision History
Changes from H Revision (November 2014) to I Revision
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Changed Handling Ratings table to ESD Ratings to comply with current formatGo
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Moved Storage temperature spec to Abs Max table Go
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Added separate row for SW pin HBM ESD rating Go
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Added condition to Recommended Operating Conditions table Go
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Changed Updated RθJA value for NHE package from "40 – 56" to "46.5"°C/W and DGK package from "240" to 152.5" °C/W; added additional thermal informationGo
Changes from G Revision (December 2005) to H Revision
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Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves sectionGo