| THERMAL METRIC(1) | LM2594, LM2594HV | UNIT |
|---|
| D (SOIC) | P (PDIP) |
|---|
| 8 PINS | 8 PINS |
|---|
| RθJA | Junction-to-ambient thermal resistance(2)(3) | 150 | 95 | °C/W |
(1) For more information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics application report,
SPRA953.
(2) The package thermal impedance is calculated in accordance to JESD 51-7.
(3) Thermal resistances were simulated on a 4 -layer, JEDEC board.