A low ESR aluminum or tantalum bypass capacitor is needed between the input pin and ground to prevent large voltage transients from appearing at the input. In addition, the RMS current rating of the input capacitor must be selected to be at least ? the DC load current. The capacitor manufacturers data sheet must be checked to assure that this current rating is not exceeded. Figure 9-1 shows typical RMS current ratings for several different aluminum electrolytic capacitor values.

This capacitor must be located close to the IC using short leads and the voltage rating must be approximately 1.5 times the maximum input voltage.

If solid tantalum input capacitors are used, TI recommends that they be surge current tested by the manufacturer.

Use caution when using ceramic capacitors for input bypassing, because it can cause severe ringing at the V_IN pin.

The important parameters for the Input capacitor are the input voltage rating and the RMS current rating. With a nominal input voltage of 12 V, an aluminum electrolytic capacitor with a voltage rating greater than 18 V
(1.5 × V_IN) is necessary. The next higher capacitor voltage rating is 25 V.

The RMS current rating requirement for the input capacitor in a buck regulator is approximately ? the DC load current. In this example, with a 400-mA load, a capacitor with a RMS current rating of at least 200 mA is needed. Figure 9-1 can be used to select an appropriate input capacitor. From the curves, locate the 25-V line and note which capacitor values have RMS current ratings greater than 200 mA. Either a 47-μF or 68-μF, 25-V capacitor can be used.

For a through hole design, a 68-μF, 25-V electrolytic capacitor (Panasonic HFQ series or Nichicon PL series or equivalent) can be adequate. Other types or other manufacturers' capacitors can be used provided the RMS ripple current ratings are adequate.

For surface-mount designs, solid tantalum capacitors are recommended. The TPS series available from AVX, and the 593D series from Sprague are both surge current tested.

For additional information, see Section 9.1.1.