ZHCS537P September 2008 – November 2014 LM22670 , LM22670-Q1
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機械、封裝和可訂購信息
封裝選項
機械數據 (封裝 | 引腳)
散熱焊盤機械數據 (封裝 | 引腳)
- DDA|8
訂購信息
6 Specifications
6.1 Absolute Maximum Ratings(1)(3)
| MIN | MAX | UNIT | |
|---|---|---|---|
| VIN to GND | 43 | V | |
| EN Pin Voltage | –0.5 | 6 | |
| RT/SYNC Pin Voltage | –0.5 | 7 | |
| SW to GND(2) | –5 | VIN | |
| BOOT Pin Voltage | VSW + 7 | ||
| FB Pin Voltage | –0.5 | 7 | |
| Power Dissipation | Internally Limited | ||
| Junction Temperature | 150 | °C | |
| For soldering specifications, refer to Application Report Absolute Maximum Ratings for Soldering (SNOA549). | |||
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and should not be operated beyond such conditions.
(2) The absolute maximum specification of the ‘SW to GND’ applies to dc voltage. An extended negative voltage limit of –10 V applies to a pulse of up to 50 ns.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.
6.2 Handling Ratings: LM22670
| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| Tstg | Storage temperature range | –65 | 150 | °C | |
| V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) | –2 | 2 | kV |
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Handling Ratings: LM22670-Q1
| MIN | MAX | UNIT | ||||
|---|---|---|---|---|---|---|
| Tstg | Storage temperature range | –65 | 150 | °C | ||
| V(ESD) | Electrostatic discharge | Human body model (HBM), per AEC Q100-002(1) | –2 | 2 | kV | |
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| VIN | Supply Voltage | 4.5 | 42 | V |
| Junction Temperature Range | –40 | 125 | °C | |
6.5 Thermal Information
| THERMAL METRIC(1)(2)(3) | LM22670, LM22670-Q1 | UNIT | ||
|---|---|---|---|---|
| DDA 8 PINS |
NDR 7 PINS |
|||
| RθJA | Junction-to-ambient thermal resistance | 60 | 22 | °C/W |
(1) For more information about traditional and new thermal metrics, see the application report IC Package Thermal Metrics (SPRA953).
(2) The value of RθJA for the PFM package of 22°C/W is valid if package is mounted to 1 square inch of copper. The RθJA value can range from 20 to 30 °C/W depending on the amount of PCB copper dedicated to heat transfer. See application note AN-1797 TO-263 THIN Package (SNVA328) for more information.
(3) The value of RθJA for the SO Power PAD-8 exposed pad package of 60°C/W is valid if package is mounted to 1 square inch of copper. The RθJA value can range from 42 to 115°C/W depending on the amount of PCB copper dedicated to heat transfer.
6.6 Electrical Characteristics
Typical values represent the most likely parametric norm at TA = TJ = 25°C, and are provided for reference purposes only. Unless otherwise specified: VIN = 12 V.| PARAMETER | TEST CONDITIONS | MIN(2) | TYP(1) | MAX(2) | UNIT | |
|---|---|---|---|---|---|---|
| LM22670-5.0 | ||||||
| VFB | Feedback Voltage | VIN = 8 V to 42 V | 4.925 | 5.0 | 5.075 | V |
| VIN = 8 V to 42 V, –40°C ≤ TJ ≤ 125°C | 4.9 | 5.1 | ||||
| LM22670-ADJ | ||||||
| VFB | Feedback Voltage | VIN = 4.7 V to 42 V | 1.266 | 1.285 | 1.304 | V |
| VIN = 4.7 V to 42 V, –40°C ≤ TJ ≤ 125°C | 1.259 | 1.311 | ||||
| ALL OUTPUT VOLTAGE VERSIONS | ||||||
| IQ | Quiescent Current | VFB = 5 V | 3.4 | mA | ||
| VFB = 5 V, –40°C ≤ TJ ≤ 125°C | 6 | |||||
| ISTDBY | Standby Quiescent Current | EN Pin = 0 V | 25 | 40 | µA | |
| ICL | Current Limit | 3.4 | 4.2 | 5.3 | A | |
| –40°C ≤ TJ ≤ 125°C | 3.35 | 5.5 | ||||
| IL | Output Leakage Current | VIN = 42 V, EN Pin = 0 V, VSW = 0 V | 0.2 | 2 | µA | |
| VSW = –1 V | 0.1 | 3 | µA | |||
| RDS(ON) | Switch On-Resistance | PFM Package | 0.12 | 0.16 | Ω | |
| PFM Package, –40°C ≤ TJ ≤ 125°C | 0.22 | |||||
| SO PowerPAD-8 Package | 0.10 | 0.16 | ||||
| SO PowerPAD-8 Package, –40°C ≤ TJ ≤ 125°C | 0.20 | |||||
| fO | Oscillator Frequency | 500 | kHz | |||
| –40°C ≤ TJ ≤ 125°C | 400 | 600 | ||||
| TOFFMIN | Minimum Off-time | 200 | ns | |||
| –40°C ≤ TJ ≤ 125°C | 100 | 300 | ||||
| TONMIN | Minimum On-time | 100 | ns | |||
| IBIAS | Feedback Bias Current | VFB = 1.3 V (ADJ Version Only) | 230 | nA | ||
| VEN | Enable Threshold Voltage | Falling | 1.6 | V | ||
| Falling, –40°C ≤ TJ ≤ 125°C | 1.3 | 1.9 | ||||
| VENHYST | Enable Voltage Hysteresis | 0.6 | V | |||
| IEN | Enable Input Current | EN Input = 0 V | 6 | µA | ||
| FSYNC | Maximum Synchronization Frequency | VSYNC = 3.5 V, 50% duty-cycle | 1 | MHz | ||
| VSYNC | Synchronization Threshold Voltage | 1.75 | V | |||
| TSD | Thermal Shutdown Threshold | 150 | °C | |||
(1) Typical values represent most likely parametric norms at the conditions specified and are not ensured.
(2) MIN and MAX limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate TI's Average Outgoing Quality Level (AOQL).
6.7 Typical Characteristics
Vin = 12 V, TJ = 25°C (unless otherwise specified)
Figure 1. Efficiency vs IOUT and VIN, VOUT = 3.3 V
Figure 3. Current Limit vs Temperature
Figure 5. Feedback Bias Current vs Temperature
Figure 7. Standby Quiescent Current vs Input Voltage
Figure 9. Normalized Feedback Voltage vs Input Voltage
Figure 2. Normalized Switching Frequency vs Temperature
Figure 4. Normalized RDS(ON) vs Temperature
Figure 6. Normalized Enable Threshold Voltage vs Temperature
Figure 8. Normalized Feedback Voltage vs Temperature
Figure 10. Switching Frequency vs RT/SYNC Resistor