ZHCSQ40C January 2023 – September 2023 LM2105
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
封裝選項
機械數據 (封裝 | 引腳)
散熱焊盤機械數據 (封裝 | 引腳)
- DSG|8
訂購信息
5 Pin Configuration and Functions
Figure 5-1 D Package, 8-Pin SOIC (Top
View)
Figure 5-2 DSG Package, 8-Pin WSON (Top View)Table 5-1 Pin Functions
| PIN | DESCRIPTION | |||
|---|---|---|---|---|
| NO.(1) | NAME | TYPE(2) | ||
| 1 |
GVDD |
P | Gate driver positive supply rail. Locally decouple to ground using low ESR and ESL capacitor located as close to IC as possible. | |
| 2 |
INH |
I | High-side control input. The INH input is compatible with TTL and CMOS input thresholds. Unused INH input must be tied to ground and not left open. | |
| 3 | INL | I | Low-side control input. The INL input is compatible with TTL and CMOS input thresholds. Unused INL input must be tied to ground and not left open. | |
| 4 |
GND |
G | Ground. All signals are referenced to this ground. | |
| 5 | GL | O | Low-side gate driver output. Connect to the gate of the low-side MOSFET or one end of external gate resistor, when used. | |
| 6 | SH | P | High-side source connection. Connect to the negative terminal of the bootstrap capacitor and to the source of the high-side MOSFET. | |
| 7 | GH | O | High-side gate driver output. Connect to the gate of the high-side MOSFET or one end of external gate resistor, when used. | |
| 8 | BST | P | High-side gate driver positive supply rail. Connect the positive terminal of the bootstrap capacitor to BST and the negative terminal of the bootstrap capacitor to SH. The bootstrap capacitor must be placed as close to IC as possible. | |
(1) For 8-pin
WSON package, TI recommends that the exposed pad on the bottom of the package be
soldered to ground plane on the PCB and the ground plane must extend out from
underneath the package to improve heat dissipation.
(2) G = Ground, I = Input, O = Output, and P = Power