ZHCSLW2C September 2021 – April 2022 ISOW7740 , ISOW7741 , ISOW7742 , ISOW7743 , ISOW7744
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 說明（接續(xù)）
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Power Ratings
- 7.6 Insulation Specifications
- 7.7 Safety-Related Certifications
- 7.8 Safety Limiting Values
- 7.9 Electrical Characteristics - Power Converter
- 7.10 Supply Current Characteristics - Power Converter
- 7.11 Electrical Characteristics Channel Isolator - VIO, VISOIN = 5-V
- 7.12 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 5-V
- 7.13 Electrical Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
- 7.14 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
- 7.15 Electrical Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
- 7.16 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
- 7.17 Electrical Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
- 7.18 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
- 7.19 Switching Characteristics - 5-V Supply
- 7.20 Switching Characteristics - 3.3-V Supply
- 7.21 Switching Characteristics - 2.5-V Supply
- 7.22 Switching Characteristics - 1.8-V Supply
- 7.23 Insulation Characteristics Curves
- 7.24 Typical Characteristics
- 8 Parameter Measurement Information
- 9 Detailed Description
- 10Application and Implementation
- 11Power Supply Recommendations
- 12Layout
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DFM|20
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
13.6 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |