ZHCSMP3A December 2019 – June 2021 ISO6731-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | ISO673x | UNIT | |
|---|---|---|---|
| DW (SOIC) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 73 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 36.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 40.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 17 | °C/W |
| ψJB | Junction-to-board characterization parameter | 39.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |