ZHCSN92H January 2020 – May 2022 ISO6720-Q1 , ISO6721-Q1 , ISO6721R-Q1
PRODUCTION DATA
| THERMAL METRIC (1) | ISO672x | ISO672xB | ISO6721RB | UNIT | |
|---|---|---|---|---|---|
| DWV (SOIC) | D (SOIC) | D (SOIC) | |||
| 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 84.3 | 104.6 | 98.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 36.3 | 48.9 | 33.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 47.0 | 52.9 | 47 | °C/W |
| ψJT | Junction-to-top characterization parameter | 7.4 | 7.9 | 2.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 45.1 | 52.1 | 46.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | n/a | °C/W |