over operating free-air temperature range (unless otherwise noted)(1)
(2)
|
|
MIN |
MAX |
UNIT |
| Supply Voltage |
VCC1, VCC2
|
–0.5 |
6 |
V |
| Input/Output Voltage |
SDA1, SCL1 |
–0.5 |
VCCX + 0.5(3)
|
V |
| SDA2, SCL2 |
–0.5 |
VCCX + 0.5(3)
|
| INx (ISO1644 only) |
-0.5 |
VCCX + 0.5 |
| Input/Output Current |
SDA1, SCL1 |
0 |
20 |
mA |
| SDA2, SCL2 |
0 |
100 |
| IIO (ISO1644 only) |
-15 |
15 |
| Temperature |
Maximum junction temperature, TJ
|
|
150 |
°C |
| Storage temperature, Tstg
|
–65 |
150 |
°C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the local ground pin (GND1 or GND2) and are peak voltage values.
(3) During powered off hotswap, the bus pins can go 0 V < SDAx, SCLx < 6 V. Maximum voltage for INx must not exceed 6 V.