SLLSFC3A March 2020 – December 2021 ISO1640-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | ISO1640-Q1 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | DW (SOIC) | |||
| 8 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 106.3 | 62.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 38.5 | 29.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 52.5 | 33.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 8.2 | 11.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 51.8 | 32.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | - | - | °C/W |