ZHCSDQ7 May 2015 HD3SS3212
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 簡化電路原理圖
- 5 修訂歷史記錄
- 6 Device Comparison Table
- 7 Pin Configuration and Functions
- 8 Specifications
- 9 Parameter Measurement Information
- 10Detailed Description
- 11Application and Implementation
- 12Power Supply Recommendations
- 13Layout
- 14器件和文檔支持
- 15機械、封裝和可訂購信息
13 Layout
13.1 Layout Guidelines
On a high-K board, TI always recommends to solder the PowerPAD™ onto the thermal land. A thermal land is the area of solder-tinned-copper underneath the PowerPAD package. On a high-K board, the HD3SS3212 can operate over the full temperature range by soldering the PowerPAD onto the thermal land without vias.
On a low-K board, for the device to operate across the temperature range, the designer must use a 1-oz Cu trace connecting the GND pins to the thermal land. A general PCB design guide for PowerPAD packages is provided in PowerPAD Thermally-Enhanced Package, SLMA002.
13.2 Layout Example
Figure 16. HD3SS3212 Basic Layout Example for Application Shown in Down Facing Port for USB3.1 Type C