ZHCSQI3A April 2022 – July 2022 ESD341
PRODUCTION DATA
| THERMAL METRIC (1) | ESD341 | UNIT | |
|---|---|---|---|
| DPL (X2SON) | |||
| 2 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 356.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 208.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 136.2 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 3.0 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 135.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | NA | °C/W |