ZHCSCW4 October   2014 DS80PCI810

PRODUCTION DATA.  

1. 1 特性
2. 2 應用
3. 3 說明
4. 4 修訂歷史記錄
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 Handling Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Electrical Characteristics
   6. 6.6 Electrical Characteristics — Serial Management Bus Interface
   7. 6.7 Timing Requirements Serial Bus Interface
   8. 6.8 Typical Characteristics
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
      1. 7.2.1 18
      2. 7.2.2 Functional Datapath Blocks
   3. 7.3 Feature Description
      1. 7.3.1 Typical 4-Level Input Thresholds
   4. 7.4 Device Functional Modes
      1. 7.4.1 Pin Control Mode:
      2. 7.4.2 Slave SMBus Mode:
      3. 7.4.3 SMBus Master Mode
      4. 7.4.4 Signal Conditioning Settings
   5. 7.5 Programming
      1. 7.5.1 EEPROM Address Map for Single Device
      2. 7.5.2 SMBus
      3. 7.5.3 Transfer Of Data Via The SMBus
      4. 7.5.4 SMBus Transactions
   6. 7.6 Register Maps
      1. 7.6.1 Writing a Register
      2. 7.6.2 Reading a Register
      3. 7.6.3 Detailed Register Map
8. 8 Applications and Implementation
   1. 8.1 Application Information
      1. 8.1.1 DS80PCI810 vs. DS80PCI800
      2. 8.1.2 Signal Integrity in PCIe Applications
      3. 8.1.3 Rx Detect Functionality in PCIe Applications
   2. 8.2 Typical Applications
      1. 8.2.1 Generic High Speed Repeater
         1. 8.2.1.1 Design Requirements
         2. 8.2.1.2 Detailed Design Procedure
         3. 8.2.1.3 Application Performance Plots
            1. 8.2.1.3.1 Pre-Channel Only Setup
            2. 8.2.1.3.2 Pre-Channel and Post-Channel Setup
      2. 8.2.2 PCIe Board Applications (PCIe Gen-3)
         1. 8.2.2.1 Design Requirements
         2. 8.2.2.2 Design Procedure
         3. 8.2.2.3 Application Performance Plots
9. 9 Power Supply Recommendations
10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
11. 11器件和文檔支持
    1. 11.1 商標
    2. 11.2 靜電放電警告
    3. 11.3 術語表
12. 12機械封裝和可訂購信息