ZHCSBM8C September 2013 – October 2014 DRV8860
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用范圍
- 3 說(shuō)明
- 4 簡(jiǎn)化電路原理圖
- 5 修訂歷史記錄
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機(jī)械封裝和可訂購(gòu)信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- PWP|16
訂購(gòu)信息
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)(3)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Power supply voltage range | VM | –0.3 | 40 | V |
| Digital input pin current range | ENABLE, LATCH, CLK, DIN | 0 | 20 | mA |
| Digital output pin voltage range | DOUT, nFAULT | –0.5 | 7 | V |
| Digital output pin current | DOUT, nFAULT | –0.5 | 7 | V |
| Output voltage range | OUTx | –0.3 | 40 | V |
| Output current range | OUTx | Internally limited | A | |
| Operating virtual junction temperature range, TJ | –40 | 150 | °C | |
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Power dissipation and thermal limits must be observed
7.2 Handling Ratings
| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| Tstg | Storage temperature range | –60 | 150 | °C | |
| V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) | –2 | 2 | kV |
| Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) | –500 | 500 | V | ||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| VM | Motor power supply voltage range | 8 | 38 | V | |
| IOUT | Low-side driver current capability | 560 | mA | ||
| TA | Operating ambient temperature range | –40 | 85 | °C | |
7.4 Thermal Information(1)
over operating free-air temperature range (unless otherwise noted)| THERMAL METRIC | TSSOP | HTSSOP | UNIT | |
|---|---|---|---|---|
| PW (16 PINS) | PWP (16 PINS) | |||
| ΘJA | Junction-to-ambient thermal resistance | 103 | 40.9 | °C/W |
| RθJC(TOP) | Junction-to-case (top) thermal resistance | 37.9 | 28.5 | |
| RθJB | Junction-to-board thermal resistance | 48 | 23.2 | |
| ΨJT | Junction-to-top characterization parameter | 3 | 0.9 | |
| ΨJB | Junction-to-board characterization parameter | 47.4 | 23.0 | |
| RθJC(BOTTOM) | Junction-to-case (bottom) thermal resistance | N/A | 3.0 | |
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.5 Electrical Characteristics
TA = 25°C, over operating free-air temperature range (unless otherwise noted)7.6 Timing Requirements
| MIN | TYP | MAX | UNIT | |||
|---|---|---|---|---|---|---|
| tPD | Propagation delay | STEP to current change | 150 | ns | ||
| tR | Rise time | IO = 150 mA, VM = 24 V, resistive load | 50 | 300 | ns | |
| tF | Fall time | 50 | 300 | ns | ||
| tOCP | Overcurrent protection deglitch time | VM = 24 V | 2.7 | 3.5 | 3.85 | µs |
| tOL | Open load detect deglitch time | Each channel separately monitored | 14 | 17 | 20 | µs |
