ZHCSC12D November 2013 – October 2019 DRV8850
PRODUCTION DATA.
| THERMAL METRIC(1) | DRV8850 | UNIT | |
|---|---|---|---|
| RGY (VQFN) | |||
| 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 39.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 41.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 15 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.6 | °C/W |
| ψJB | Junction-to-board characterization parameter | 14.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.2 | °C/W |