SLVSAB9E May 2010 – November 2015 DRV8814
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range, unless otherwise noted.(1)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Power supply voltage range | VMx | –0.3 | 47 | V |
| Power supply ramp rate | VMx | 1 | V/µs | |
| Digital pin voltage range | –0.5 | 7 | V | |
| Input voltage | VREF | –0.3 | 4 | V |
| ISENSEx pin voltage(2) | –0.8 | 0.8 | V | |
| Peak motor drive output current, t < 1 μS | Internally limited | A | ||
| Continuous motor drive output current(3) | 0 | 2.5 | A | |
| Continuous total power dissipation | See Thermal Information | |||
| Operating virtual junction temperature range, TJ | –40 | 150 | °C | |
| Operating ambient temperature range, TA | –40 | 85 | °C | |
| Storage temperature, TSTG | –60 | 150 | °C | |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Transients of ±1 V for less than 25 ns are acceptable.
(3) Power dissipation and thermal limits must be observed.
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±500 | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| VM | Motor power supply voltage range(1) | 8 | 45 | V | |
| VREF | VREF input voltage(2) | 1 | 3.5 | V | |
| IV3P3 | V3P3OUT load current | 0 | 1 | mA | |
| fPWM | Externally applied PWM frequency | 0 | 100 | kHz | |
(1) All VM pins must be connected to the same supply voltage.
(2) Operational at VREF between 0 V and 1 V, but accuracy is degraded.
6.4 Thermal Information
| THERMAL METRIC(1) | DRV8814 | UNIT | |
|---|---|---|---|
| PWP (HTSSOP) | |||
| 28 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 31.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 15.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 5.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 5.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.4 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| POWER SUPPLIES | ||||||
| IVM | VM operating supply current | VM = 24 V, fPWM 50 kHz | 5 | 8 | mA | |
| IVMQ | VM sleep mode supply current | VM = 24 V | 10 | 20 | μA | |
| VUVLO | VM undervoltage lockout voltage | VM rising | 7.8 | 8.2 | V | |
| V3P3OUT REGULATOR | ||||||
| V3P3 | V3P3OUT voltage | IOUT = 0 to 1 mA | 3.2 | 3.3 | 3.4 | V |
| LOGIC-LEVEL INPUTS | ||||||
| VIL | Input low voltage | 0.6 | 0.7 | V | ||
| VIH | Input high voltage | 2 | 5.25 | V | ||
| VHYS | Input hysteresis | 0.3 | 0.45 | 0.6 | V | |
| IIL | Input low current | VIN = 0 | –20 | 20 | μA | |
| IIH | Input high current | VIN = 3.3 V | 33 | 100 | μA | |
| nFAULT OUTPUT (OPEN-DRAIN OUTPUT) | ||||||
| VOL | Output low voltage | IO = 5 mA | 0.5 | V | ||
| IOH | Output high leakage current | VO = 3.3 V | 1 | μA | ||
| DECAY INPUT | ||||||
| VIL | Input low threshold voltage | For slow decay (brake) mode | 0 | 0.8 | V | |
| VIH | Input high threshold voltage | For fast decay (coast) mode | 2 | V | ||
| IIN | Input current | VIN = 0 V to 3.3 V | ±40 | μA | ||
| H-BRIDGE FETS | ||||||
| RDS(ON) | HS FET on resistance | VM = 24 V, IO = 1 A, TJ = 25°C | 0.2 | Ω | ||
| VM = 24 V, IO = 1 A, TJ = 85°C | 0.25 | 0.32 | ||||
| RDS(ON) | LS FET on resistance | VM = 24 V, IO = 1 A, TJ = 25°C | 0.2 | Ω | ||
| VM = 24 V, IO = 1 A, TJ = 85°C | 0.25 | 0.32 | ||||
| IOFF | Off-state leakage current | –20 | 20 | μA | ||
| MOTOR DRIVER | ||||||
| fPWM | Internal current control PWM frequency | 50 | kHz | |||
| tBLANK | Current sense blanking time | 3.75 | μs | |||
| tR | Rise time | 50 | 300 | ns | ||
| tF | Fall time | 50 | 300 | ns | ||
| PROTECTION CIRCUITS | ||||||
| IOCP | Overcurrent protection trip level | 3 | A | |||
| tTSD | Thermal shutdown temperature | Die temperature | 150 | 160 | 180 | °C |
| CURRENT CONTROL | ||||||
| IREF | VREF input current | VREF = 3.3 V | –3 | 3 | μA | |
| VTRIP | xISENSE trip voltage | xVREF = 3.3 V, 100% current setting | 635 | 660 | 685 | mV |
| xVREF = 3.3 V, 71% current setting | 445 | 469 | 492 | |||
| xVREF = 3.3 V, 38% current setting | 225 | 251 | 276 | |||
| AISENSE | Current sense amplifier gain | Reference only | 5 | V/V | ||
6.6 Typical Characteristics
