SLVSA72E April 2010 – October 2015 DRV8813
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
- PWP|28
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- PWP|28
訂購信息
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| VMx | Power supply voltage | –0.3 | 50 | V | |
| Power supply ramp rate | 1 | V/µs | |||
| Digital pin voltage | –0.5 | 7 | V | ||
| VREF | Input voltage | –0.3 | 4 | V | |
| ISENSEx pin voltage(4) | –0.8 | 0.8 | V | ||
| Peak motor drive output current, t < 1 μS | Internally limited | A | |||
| Continuous motor drive output current(3) | 0 | 2.5 | A | ||
| Continuous total power dissipation | See Thermal Information | ||||
| TJ | Operating virtual junction temperature | –40 | 150 | °C | |
| TA | Operating ambient temperature | –40 | 85 | °C | |
| Tstg | Storage temperature | –60 | 150 | °C | |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Power dissipation and thermal limits must be observed.
(4) Transients of ±1V for less than 25 ns are acceptable
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) | ±2000 | V |
| Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) | ±500 | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| VM | Motor power supply voltage(1) | 8.2 | 45 | V | |
| VREF | VREF input voltage(2) | 1 | 3.5 | V | |
| IV3P3 | V3P3OUT load current | 0 | 1 | mA | |
| fPWM | Externally applied PWM frequency | 0 | 100 | kHZ | |
(1) All VM pins must be connected to the same supply voltage.
(2) Operational at VREF from 0 V to 1 V, but accuracy is degraded.
6.4 Thermal Information
| THERMAL METRIC(1) | DRV8813 | UNIT | |
|---|---|---|---|
| PWP (HTSSOP) | |||
| 28 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 31.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 15.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 5.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 5.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.4 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| POWER SUPPLIES | ||||||
| IVM | VM operating supply current | VM = 24 V, fPWM < 50 kHz | 5 | 8 | mA | |
| IVMQ | VM sleep mode supply current | VM = 24 V | 10 | 20 | μA | |
| VUVLO | VM undervoltage lockout voltage | VM rising | 7.8 | 8.2 | V | |
| V3P3OUT REGULATOR | ||||||
| V3P3 | V3P3OUT voltage | IOUT = 0 to 1 mA | 3.2 | 3.3 | 3.4 | V |
| LOGIC-LEVEL INPUTS | ||||||
| VIL | Input low voltage | 0.6 | 0.7 | V | ||
| VIH | Input high voltage | 2.2 | 5.25 | V | ||
| VHYS | Input hysteresis | 0.3 | 0.45 | 0.6 | V | |
| IIL | Input low current | VIN = 0 | –20 | 20 | μA | |
| IIH | Input high current | VIN = 3.3 V | 100 | μA | ||
| RPD | Internal pulldown resistance | 100 | kΩ | |||
| nFAULT OUTPUT (OPEN-DRAIN OUTPUT) | ||||||
| VOL | Output low voltage | IO = 5 mA | 0.5 | V | ||
| IOH | Output high leakage current | VO = 3.3 V | 1 | μA | ||
| DECAY INPUT | ||||||
| VIL | Input low threshold voltage | For slow decay mode | 0 | 0.8 | V | |
| VIH | Input high threshold voltage | For fast decay mode | 2 | V | ||
| IIN | Input current | ±40 | µA | |||
| RPU | Internal pullup resistance (to 3.3 V) | 130 | kΩ | |||
| RPD | Internal pulldown resistance | 80 | kΩ | |||
| H-BRIDGE FETS | ||||||
| RDS(ON) | HS FET on resistance | VM = 24 V, IO = 1 A, TJ = 25°C | 0.2 | Ω | ||
| VM = 24 V, IO = 1 A, TJ = 85°C | 0.25 | 0.32 | ||||
| LS FET on resistance | VM = 24 V, IO = 1 A, TJ = 25°C | 0.2 | ||||
| VM = 24 V, IO = 1 A, TJ = 85°C | 0.25 | 0.32 | ||||
| IOFF | Off-state leakage current | –20 | 20 | μA | ||
| MOTOR DRIVER | ||||||
| fPWM | Internal current control PWM frequency | 50 | kHz | |||
| tBLANK | Current sense blanking time | 3.75 | μs | |||
| tR | Rise time | 30 | 200 | ns | ||
| tF | Fall time | 30 | 200 | ns | ||
| PROTECTION CIRCUITS | ||||||
| IOCP | Overcurrent protection trip level | 3 | A | |||
| tTSD | Thermal shutdown temperature | Die temperature | 150 | 160 | 180 | °C |
| CURRENT CONTROL | ||||||
| IREF | xVREF input current | xVREF = 3.3 V | –3 | 3 | μA | |
| VTRIP | xISENSE trip voltage | xVREF = 3.3 V, 100% current setting | 635 | 660 | 685 | mV |
| xVREF = 3.3 V, 71% current setting | 445 | 469 | 492 | |||
| xVREF = 3.3 V, 38% current setting | 225 | 251 | 276 | |||
| AISENSE | Current sense amplifier gain | Reference only | 5 | V/V | ||
6.6 Typical Characteristics
